US20240040808A1: Techniques based on directional seeding & selective deposition (Part-2)

Published in US Patent, 2024

Recommended citation: M. A. Zeeshan, K. Chan, S. Kallakuri*, S. Varghese. 2024. "Techniques and device structure based upon directional seeding and selective deposition (Part-2)." US Patent. US20240040808A1 /files/pdf/patents/US20240040808A1.pdf