Patents

US11956978: Techniques based on directional seeding & selective deposition (Part-1)

M. A. Zeeshan, K. Chan, S. Kallakuri*, S. Varghese. 2024. "Techniques and device structure based upon directional seeding and selective deposition (Part-1)." US Patent. US11956978B2

US20240040808A1: Techniques based on directional seeding & selective deposition (Part-2)

M. A. Zeeshan, K. Chan, S. Kallakuri*, S. Varghese. 2024. "Techniques and device structure based upon directional seeding and selective deposition (Part-2)." US Patent. US20240040808A1

US11749564: Techniques for void-free material depositions (Part-1)

M. A. Zeeshan, K. Chan, S. Kallakuri*, S. Varghese, J. Hautala. 2023. "Techniques for void-free material depositions (Part-1)." US Patent. US11749564

US12131948: Techniques for void-free material depositions (Part-2)

M. A. Zeeshan, K. Chan, S. Kallakuri*, S. Varghese, J. Hautala. 2023. "Techniques for void-free material depositions (Part-2)." US Patent. US12131948

US11404314: Metal line patterning

S. Varghese, M. A. Zeeshan, S. Kallakuri*, K. Chan. 2022. "Metal line patterning." US Patent. US11404314

US20220119955A1: Techniques for variable deposition profiles

M. A. Zeeshan, S. Kallakuri*, J. C. Olson. 2022. "Techniques for variable deposition profiles." US Patent. US20220119955A1

US20220100078A1: Devices and methods for variable etch depths

M. A. Zeeshan, R. Bandy, P. F. Kurunczi, S. Kallakuri*, T. Soldi, J. C. Olson. 2022. "Devices and methods for variable etch depths." US Patent. US20220100078A1

^* Equal co-inventor

Shantanu Kallakuri