Patents

• Techniques based on directional seeding & selective deposition (Part-1: US11956978B2)
• Techniques based on directional seeding & selective deposition (Part-2: US20240040808A1)
• Techniques for void-free material depositions (Part-1: US11749564B2)
• Techniques for void-free material depositions (Part-2: US12131948B2)
• Metal line patterning (US11404314B2)
• Devices and methods for variable etch depths (US20220100078A1)
• Techniques for variable deposition profiles (US20220119955A1)